Next Generation Fine-Pitch Wafer Probing
Massively Parallel
Increase Test Efficiency
Customizable
Template-free 3D Printed ProbesCompatible
MicroPCB & Probe Stations
Unmatched Precision
Industry-leading min.
Pitch & Planarity
Modular Design
Maximize Uptime & Yield
The new way to solve existing challenges
The pace of semiconductor device miniaturization is posing unprecedented challenges to the established testing industry. As nodes get smaller and components sizes shrink, the increased interconnect density demands innovative solutions. Accessing smaller pads with finer pitches requires lower and well-defined probe forces.
Introducing Exaddon micro3D probes
Exaddon micro3D probes are generated from a unique micro3D printing technology which unlocks high tip positioning accuracy and unprecedented small pitches. The sub-micron precision results from a “print at place” approach; this eliminates any inaccuracies resulting from replacing probes or human interactions, as can happen with other technologies. With Exaddon's next generation manufacturing method, <20 µm pitch wafer probing is now accessible!
Exaddon’s integrated probe head design is modular; it allows for fast and convenient probe head exchange, giving the shortest average time to repair. It is easily adapted to other test pad layouts - all with the same probe card.
Benefits We Offer
Go Beyond Fine Pitch
Reliably access fine pitch pads and bumps with minimal contact damage
Maximize Uptime
And minimize costs through fast exchange of the integrated microPCB probe head
Design Customization
Your challenge is our customized solution.
We support your case by building ad hoc testing solutions
Spotlight: MicroLED Parallel Testing
Exaddon’s process delivers probes of customizable design, 3D printed directly on microPCBs. This multi-layer microPCB acts as the interposer, probe head, and fan-out. It is compatible with current probe stations.
With 128 probes, our microL64 gives microLED testers a 64x increase in test efficiency. A wafer that would otherwise require 2 months for 100% testing can now be inspected in less than a day.
The layout of Exaddon’s microL64 probe head is customizable, and with a pitch of less than 20 μm, we are breaking the current industry limit and setting the start point for a new era in enabling scaling down the size of microLED testing.
The exceptional planarity (±2 µm) allows for low overdrive, decreasing the testing time.
MicroLED testing with Exaddon's 3D printed probes has received excellent industry reception in Taiwan, Japan and the USA.
Beyond microLEDs, any applications which need fine-pitch probing stand to benefit from this approach, including parametric test, microbump contacting, RF applications, and more.
Specifications: MicroLED Probe Head
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- - - Please note that all parameters are customizable per the customer's requirements. Values shown are from tested devices. - - -
- Probe positioning accuracy (x, y) ±2 µm
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Probe pitch (x)
18.5 µm
- Probe z - planarity ±2 µm
- Scrub mark depth <100 nm
- Scrub mark length 5 µm
- Tip length 85 µm
- Probe count 64 - 256
- Probe shape (can be fully customized) cantilever
- Reliable electrical contact @ (OD) 12 µm
- Touchdowns (lifetime) 1 million
Fine-Pitch MicroLED Testing - How it Works:
Design
Substrate is customized for any probe test pad layout.
Design
Probe geometry, pad scrub length & performance criteria are set and simulated.
Printing
Probes are 3D printed directly on microPCB probe head.
Multi-layer microPCB acts as interposer, probe head & fan-out.
MicroPCB is quickly and easily installed or exchanged, maximizing probe station uptime.
Evaluation
MicroLED testing and evaluation begins (or is continued) with the most precise and customizable probes available.
Our Products: Discover Micro3D Printed Probes
MicroLED Testing
Fine-pitch microLED testing with the Exaddon microL64.
Parametric Test / WAT
Ultra-low leakage for Parametric and Wafer Acceptance Test (WAT) with the Exaddon microPT12.
Custom Solutions
Testing directly on microbumps? Four-point contacts? Low invasive pad scrub tests? Contact us directly to explore custom solutions together.
Please speak to us directly to learn more about our probe head solutions. Through ongoing collaboration with probe card suppliers, we can support customers with turnkey probe card solutions, or customized, alternative probing solutions.