Exaddon 3D Printed Probes.

 

 


The Enabling Test Technology for High Volume microLED Manufacturing

Massively Parallel

Increase Test Efficiency



Customizable

Template-free 3D Printed Probes




Compatible

MicroPCB & Probe Stations



Unmatched Precision

Industry-leading min. 
Pitch & Planarity



Modular Design

Maximize Uptime & Yield

Unlock microLED Mass Production with Exaddon Wafer Probing


The pace of semiconductor device miniaturization is posing unprecedented challenges to the established testing industry. As nodes get smaller and components sizes shrink, the increased interconnect density demands innovative solutions. Accessing smaller pads with finer pitches requires lower and well-defined probe forces.


Next Generation Solutions for Testing at Scale


Exaddon micro3D probes are generated from a unique micro3D printing technology which unlocks high tip positioning accuracy and unprecedented small pitches. The sub-micron precision results from a “print at place” approach; this eliminates any inaccuracies resulting from replacing probes or human interactions, as can happen with other technologies. With Exaddon's next generation manufacturing method, <20 µm pitch wafer probing is now accessible! 


Exaddon’s integrated probe head design is modular; it allows for fast and convenient probe head exchange, giving the shortest average time to repair. It is easily adapted to other test pad layouts - all with the same probe card.


Benefits We Offer

SEM image of Exaddon 3D printed probes with less than 20 micron pitch.

Ultra Fine Pitch

Reliably access fine pitch pads and bumps with minimal contact damage

The Exaddon microL64 microLED probe head next to a probe card.

Maximize Uptime

 And minimize costs through fast exchange of the integrated microPCB probe head

A microscale spiral probe 3D printed by Exaddon.

Design Customization

Your challenge is our customized solution.

We support your case by building ad hoc testing solutions


Spotlight: MicroLED Parallel Testing

Exaddon’s process delivers probes of customizable design, 3D printed directly on microPCBs. This multi-layer microPCB acts as the interposer, probe head, and fan-out. It is compatible with current probe stations. 


With 128 probes, our microL64 gives microLED testers a 64x increase in test efficiency. A wafer that would otherwise require 2 months for 100% testing can now be inspected in less than a day.


The layout of Exaddon’s microL64 probe head is customizable, and with a pitch of less than 20 μm, we are breaking the current industry limit and setting the start point for a new era in enabling scaling down the size of microLED testing.


The exceptional planarity (±2 µm) allows for low overdrive,  decreasing the testing time.


MicroLED testing with Exaddon's 3D printed probes has received excellent industry reception in Taiwan, Japan and the USA.


Beyond microLEDs, any applications which need fine-pitch probing stand to benefit from this approach, including parametric test, microbump contacting, RF applications, and more.

 

A close up image of the Exaddon microL64 PCB, showing the fanout pattern and gap for microLED.

Specifications: MicroLED Probe Head



  • - - - Please note that all parameters are customizable per the customer's requirements. Values shown are from tested devices. - - - 


  • Probe positioning accuracy (x, y)  ±2 µm
  • Probe pitch (x)  18.5 µm
  • Probe z - planarity ±2 µm
  • Scrub mark depth <100 nm
  • Scrub mark length 5 µm
  • Tip length 85 µm
  • Probe count 64 - 256
  • Probe shape (can be fully customized) cantilever
  • Reliable electrical contact @ (OD) 12 µm
  • Touchdowns (lifetime) 1 million

Fine-Pitch MicroLED Testing - How it Works:

Substrate
Design

Substrate is customized for any probe test pad layout.

An image of the Exaddon microL64 PCB, showing the fanout pattern and gap for microLED.
Probe
Design

Probe geometry, pad scrub length & performance criteria are set and simulated.

A microscale spiral probe 3D printed by Exaddon.
 Probe
Printing

Probes are 3D printed directly on microPCB probe head.

Multi-layer microPCB acts as interposer, probe head & fan-out.

A rendered image showing a cantilever probe being printed by Exaddon technology.
Install

MicroPCB is quickly and easily installed or exchanged, maximizing probe station uptime. 

An engineer replacing the Exaddon microL64 probe head with just a screwdriver.
Test &
Evaluation

MicroLED testing and evaluation begins (or is continued) with the most precise and customizable probes available. 

The Exaddon microL64 microLED probe head installed in a probe station for testing.

Our Products: Discover Micro3D Printed Probes

The Exaddon microL64 probe head mounted on a probe card.

MicroLED Testing

Fine-pitch microLED testing with the Exaddon microL64.

A row of Exaddon micro3D printed probes for parametric wafer testing.

Parametric Test / WAT

Ultra-low leakage for Parametric and Wafer Acceptance Test (WAT) with the Exaddon microPT12.

An array of 2000 spiral probes, 3D printed by Exaddon.

Custom Solutions 

Testing directly on microbumps? Four-point contacts? Low invasive pad scrub tests? Contact us directly to explore custom solutions together.

Please speak to us directly to learn more about our probe head solutions. Through ongoing collaboration with probe card suppliers, we can support customers with turnkey probe card solutions, or customized, alternative probing solutions. 


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