Our Products.
Next Generation Wafer Probing
Our Products.
Next Generation Wafer Probing
Exaddon currently offers three product options for ultrafine pitch, high-precision wafer probing applications. The modular design and exceptional precision of micro3D printing deliver unmatched customization and accuracy.
The probes are micro3D printed in pure copper, which offers excellent conductivity. These are then coated in an optimized nickel-alloy for excellent mechanical strength, contact reliability and durability. The shape and diameter can be tailored per application requirements.
MicroLED Testing - Exaddon microL64
Developed specifically for the parallel testing of super fine pitch microLEDs at a wafer level, the microL64 comprises 128 micro3D printed probes for contacting 64 LEDs simultaneously.
Printed directly on a custom microPCB with exceptional z-planarity and <20 µm possible pitch, the microL64 offers unprecedented test access to the latest microLED technology.
Parameters such as pitch, probe tip shape, probe diameter, and z-planarity can all be customized.
WAT Testing -
Exaddon microPT12
Building on the success of our microLED testing solutions, we are addressing the needs of WAT/parametric test teams who require super fine pitch, low-invasive, customized probe solutions.
Parameters such as pitch, probe tip shape, probe diameter, and z-planarity can all be customized.
Custom Probe Solutions
Whether microbumps, four-point contacts, low-invasive pad scrub tests, or any other fine-pitch test application, we can offer a unique solution to address the challenges you face.
Contact us directly to explore custom solutions together.
Please speak to us directly to learn more about our probe head solutions. Through ongoing collaboration with probe card suppliers, we can support customers with turnkey probe card solutions, or customized, alternative probing solutions.